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Accelerate your SiP packaging and 2.5D IC stacking time-to-market.
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Copper Pillar Module
Copper Pillar Module Solution
Accelerate your SiP packaging and 2.5D IC stacking time-to-market.
We standardize complex packaging technology. No expensive electroplating lines required — use your existing SMT equipment to achieve high-density interconnects and dramatically shorten development cycles.
CORE VALUE
Core Advantages
SPEED
Fast Integration
Provides a standardized packaging path for PoP (Package on Package), SiP, and 2.5D applications, reducing time spent on development exploration.
COST
Cost Efficiency
Eliminates costly electroplating equipment investment. Existing SMT pick-and-place machines can mount directly, enabling low-cost mass production.
FLEXIBILITY
Flexible Customization
Offers flexible configuration and fully customized production services tailored to your specific XPU and substrate designs.
POSITIONING
Industry Applications & Strategic Positioning
Compared to traditional solder balls and wafer-level copper pillar processes, here is how modular solutions position themselves in terms of adoption barriers and flexibility:
| Feature | Traditional Solder Ball | Copper Pillar Bump (Wafer-Level Process) |
Copper Pillar Module (Modular Solution) |
Business Value |
|---|---|---|---|---|
| Interconnect Density | Limited by solder ball size — large pitch, low density | High Density (Fine Pitch) | High Density (Fine Pitch) | Meets high-frequency signal transmission requirements |
| Electrical Performance | High resistance and inductance | High Density (Fine Pitch) | High Density (Fine Pitch) | Meets high-frequency signal transmission requirements |
| Process Structure | Flexible solder balls, prone to collapse | Rigid structure, dimensionally stable | Rigid structure + integrated molding support | High reliability, controlled stacking height |
| Infrastructure | Standard packaging line | Requires high-end wafer electroplating Fab (High Capex) Capex） |
Works on existing SMT production lines | Extremely low adoption barrier, fast mass production |
| Design Flexibility | Primarily standardized mass production | Limited by equipment electroplating height | Highly flexible, fully customized service | Meets specific R&D and application requirements |
POSITIONING
Key Technical Breakthrough:
Precise Height Control & Packaging Reliability
The biggest challenge for customers is height uniformity constraints with electroplated copper pillars, leading to voids or bridging during stacking. Modular technology uses pre-fabricated pillars combined with high-precision curing adhesive — no reliance on real-time electroplating growth.
- Precise Height — Modules are height-calibrated before shipment, eliminating variation from the electroplating process.
- Structural Stability — Curing adhesive provides better support than traditional Underfill after reflow, preventing solder cracking caused by CTE mismatch.
SOLUTION SELECTOR
Product Line Selector
Choose the right copper pillar module series based on your development stage and application requirements:
G1
Copper Pillar Module
Pin module
High design freedom, supports large current (3–5A/pin), rapid custom prototyping.
Suitable for
G3
Integrated Molding Module
molding interposer pin module
Mature SMT mass production process, dual-sided protrusion design enhances solder strength.
Suitable for
G4/G5
Ceramic Solution
Ceramic Molding Interposer Pin
High thermal conductivity, low dielectric loss, stable at high temperature and high frequency.
Suitable for
WHERE IT FITS
Application Scenarios
Copper pillar modules have been deployed across these five major application areas, covering diverse reliability and cost requirements from high-performance computing to RF modules.
01
AI Servers & High-Performance Computing
AI SERVER / HPC
Pain Points
In 2.5D/3D IC stacking, signal integrity and thermal dissipation between HBM and compute chips are the primary bottlenecks — traditional solder ball pitch cannot meet high-bandwidth demands.
Entry Points
Fine pitch copper pillar modules provide short conduction paths and low resistance/inductance. Bidirectional interlocking architecture enhances vertical thermal conductivity, ideal for multi-layer stacking interposer applications.
Recommended Series
G1 (R&D Validation) / G4-G5 (Mass Production)
02
Power Semiconductor Modules
POWER MODULE / SiC・GaN
Pain Points
Power components must carry large currents while facing reliability challenges under high-temperature cycling — traditional underfill materials are prone to solder cracking due to CTE mismatch.
Entry Points
The G1 series supports 3–5A/pin high-current design. Curing adhesive provides superior mechanical support compared to traditional underfill, reducing failure risks caused by thermal stress.
Recommended Series
G1 (High-Current Design) / G3 (Stable Mass Production)
03
Consumer Electronics SiP Modules
WEARABLES / MOBILE SiP
Pain Points
In 2.5D/3D IC stacking, signal integrity and thermal dissipation between HBM and compute chips are the primary bottlenecks — traditional solder ball pitch cannot meet high-bandwidth demands.
Entry Points
Fine pitch copper pillar modules provide short conduction paths and low resistance/inductance. Bidirectional interlocking architecture enhances vertical thermal conductivity, ideal for multi-layer stacking interposer applications.
Recommended Series
G1 (R&D Validation) / G4-G5 (Mass Production)
04
Automotive Electronics
AUTOMOTIVE ELECTRONICS
Pain Points
Automotive standards demand long-term high-temperature stability and strict coplanarity tolerances — conventional packaging technologies struggle to meet both reliability and cost requirements simultaneously.
Entry Points
Coplanarity < 1mil (better than JEDEC standards), combined with full-line AOI inspection, meets automotive demands for consistency and traceability.
Recommended Series
G3 (Standard Solution) / G4-G5 (Based on Power Requirements)
05
RF / Millimeter-Wave Modules
RF & mmWave MODULES
Pain Points
High-frequency signals are extremely sensitive to impedance matching and signal loss — the inductance effects of traditional solder ball structures degrade high-frequency performance.
Entry Points
Short conduction paths reduce parasitic inductance. Combined with the low dielectric loss of ceramic solutions, this meets the demands of 5G/6G and satellite communication modules.
Recommended Series
G4-G5 (Ceramic Solution)
DATASHEET
Technical Specifications
Process Specifications
Copper Pillar Diameter
≥ 60 μm
Center Pitch
≥ 70 μm
Inspection Standard
Full-line Automated AOI Inspection
Inspection covers missing pins, height, and coplanarity. Packaging options include Reel and Tray formats to meet both automated production lines and R&D prototyping needs.
FAQ
Technical Q&A
Why Choose Copper Pillar Modules Over Traditional Solder Balls?
Why Choose Copper Pillar Modules Over Traditional Solder Balls? 
Traditional solder balls are limited by surface tension, resulting in larger pitch and a tendency to collapse. Copper pillar modules offer finer pitch and shorter conduction paths, significantly reducing resistance and inductance to meet the extreme signal integrity and power delivery demands of modern AI and HPC applications.
How does this differ from Copper Pillar Bump (wafer-level process)?
How does this differ from Copper Pillar Bump (wafer-level process)? - Process Barrier — Copper Pillar Bumps must be fabricated in a semiconductor fab using expensive masks and electroplating equipment with enormous capex. Modules standardize copper pillar technology into a component format, enabling equivalent high-density interconnects on standard SMT lines.
- Flexibility & Cycle Time — The Bump process is extremely unfriendly to small batches or diverse designs with long lead times. Modules support fully customized heights and layouts, enabling rapid prototyping without millions in wafer mask costs.
- Structural Support — Modules combine integrated molding and curing adhesive technology, providing better mechanical support than bare bumps, effectively solving warpage issues in large-format packages.
Can my existing SMT line mount these directly? Is special Flip-Chip equipment required?
Can my existing SMT line mount these directly? Is special Flip-Chip equipment required?
Yes — that’s the core value proposition. Modules offer excellent SMT compatibility with no need for expensive wafer-bonding equipment. Through calculated pad compensation (+50–100μm), tilt and offset errors during assembly are perfectly absorbed, enabling accurate high-volume production using your existing high-speed pick-and-place machines.
How do you overcome stacking height limitations and electroplating uniformity constraints?
How do you overcome stacking height limitations and electroplating uniformity constraints?
With traditional Copper Pillar Bumps, height variation between wafer edge and center during electroplating often leads to voids or open circuits during stacking. Through “Pre-fabricated Pillar” technology, every pillar is precisely calibrated before shipment (coplanarity < 2mil), fundamentally eliminating the physical limitations of electroplating equipment and ensuring absolute height consistency after stacking.
Ready to Validate Your Packaging Design?
G1 / G3 / G4-G5 sample prototyping available.
Customized configuration recommendations based on your XPU and substrate specifications.