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Extending the Path: From Technical Points to Solutions
Extending the path: building on the advantages above, we have developed solutions tailored to different levels of need.
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iPIN Copper Pillar Interconnect Technology
iPIN Connectivity
“Pushing the limits of physics, engineered for precision environments.”
Designed for extreme-precision applications such as Probe Testers and 3D Packages, iPIN offers superior flexibility and structural strength compared to conventional copper pillars. As our patented product positioned for packaging trends over the next 5–10 years, iPIN is engineered to solve physical fatigue issues that arise during extreme miniaturization.
Solution Details
iPIN Connectivity is our advanced solution for ultra-precise semiconductor applications. Contact us to learn how iPIN can meet your most demanding interconnect requirements.
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